US Patent Issued to POWER MASTER SEMICONDUCTOR on Sept. 29 for "Semiconductor device" (South Korean Inventors)

Posted On: 2026-09-30

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,296, issued on Sept. 29, was assigned to POWER MASTER SEMICONDUCTOR Co. LTD. (Cheongju-si, South Korea). "Semiconductor device" was invent... Read More

US Patent Issued to Infineon Technologies Austria on Sept. 29 for "Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices" (Singaporean, German Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,297, issued on Sept. 29, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor device comprising a leadframe... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor device and semiconductor package including the same" (South Korean Inventor)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,299, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and semiconductor pac... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor package" (South Korean Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,300, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Min... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Miniaturized high-capacity semiconductor package" (South Korean Inventor)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,301, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Miniaturized high-capacity semiconductor p... Read More

US Patent Issued to LG INNOTEK on Sept. 29 for "Circuit board and semiconductor package comprising same" (South Korean Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,302, issued on Sept. 29, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board and semiconductor package comprising sam... Read More

US Patent Issued to Absolics on Sept. 29 for "Method of manufacturing packaging substrate and packaging substrate manufactured thereby" (South Korean, American Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,303, issued on Sept. 29, was assigned to Absolics Inc. (Covington, Ga.). "Method of manufacturing packaging substrate and packaging substr... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Anchor-containing underfill structures for a chip package and methods of forming the same" (Taiwanese Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,304, issued on Sept. 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Anchor-containing underfill struc... Read More

US Patent Issued on Sept. 29 for "Submounts with stud protrusions for semiconductor packages" (North Carolina Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,305, issued on Sept. 29. "Submounts with stud protrusions for semiconductor packages" was invented by Afshin Dadvand (Durham, N.C.) and De... Read More

US Patent Issued to QUALCOMM on Sept. 29 for "Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods" (California Inventors)

Posted On: 2026-09-30

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ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,306, issued on Sept. 29, was assigned to QUALCOMM Inc. (San Diego). "Substrate employing core with cavity embedding reduced height electri... Read More

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US Patent Issued to POWER MASTER SEMICONDUCTOR on Sept. 29 for "Semiconductor device" (South Korean Inventors)

US Patent Issued to Infineon Technologies Austria on Sept. 29 for "Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices" (Singaporean, German Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor device and semiconductor package including the same" (South Korean Inventor)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor package" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Miniaturized high-capacity semiconductor package" (South Korean Inventor)

US Patent Issued to LG INNOTEK on Sept. 29 for "Circuit board and semiconductor package comprising same" (South Korean Inventors)

US Patent Issued to Absolics on Sept. 29 for "Method of manufacturing packaging substrate and packaging substrate manufactured thereby" (South Korean, American Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 29 for "Anchor-containing underfill structures for a chip package and methods of forming the same" (Taiwanese Inventors)

US Patent Issued on Sept. 29 for "Submounts with stud protrusions for semiconductor packages" (North Carolina Inventors)

US Patent Issued to QUALCOMM on Sept. 29 for "Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (IC) packages and fabrication methods" (California Inventors)